Blog

Latest news and events
from bespline

November 27, 2024

bespline collaboration with TRU Simulation and Immersive Display Solutions showcased at IITSEC

bespline is showcasing some of its products for the simulation industry at I/ITSEC 2024 in Orlando. Its partners Immersive Display Solutions and TRU Simulation and Training will be showing respectively a 3.5 meter diameter dome and a VR cockpit. Come and visit TRU Simulation Booth #2248 and Immersive Display Solutions Booth #1381.

October 18, 2024

bespline presents 3D cladding panels at Chicago Build Expo on Oct. 22-23, booth #324

bespline is exposing several uniquely shaped cladding panels, with different finishes including the astonishing 3D wood.

September 26, 2024

bespline presents session on Composites Kitting at IBEX 2024

bespline is co-leading an educational session at this year’s International BoatBuilders Exhibition & Conference (IBEX, October 1-3) in Tampa, Florida. In this session, two composites veterans will discuss recent advances such as thermoformed foam core panels that eliminate the need for contour cut foam or thermoforming of foam cores on the shop floor. 2:00-3:30 pm, Wednesday, Oct 2 – Room 107-108

September 20, 2024

bespline presents session on Advances in Tooling/Molds at IBEX 2024

bespline is co-leading an educational session at this year’s International Boat Builders Exhibition & Conference (IBEX, October 1-3) in Tampa, Florida, at 4:00-5:30 pm, Wednesday, Oct 2 – Room 114 - bespline Booth 1-121

August 30, 2024

bespline shows curved composite capabilities at CAMX 2024

Booth S56 – September 9-11, San Diego, CA

June 1, 2024

bespline + ekoa® = Sustainably Curved Plant-Based Interiors

Low-carbon, Clean-Air Gold Certified ekoa® is sustainably shaped into bespoke organic surfaces using bespline’s low-energy, reconfigurable digital molding system.

March 8, 2024

3D Curved Innovations for Architectural Acoustics

bespline and Feltkütur deliver optimal sound diffusion and distinctive aesthetics via QuietCurve and Hëlm products.